PCB Assembly
Our latest PCBA & SMT capabilities include support for 01005, high-count BGAs, POP, RF, press fit,
wave and selective soldering for double and single sided reflow.
  • (AOI) Automated Optical Inspection
  • PCBA Manufacturer (Layers 1-8) Smt, Thru-Hole, With Single And Double Sided Reflow
  • No-Clean And Water Soluble Flux.
  • Lead-Free / Rohs Compliant Wave Soldering.
  • PCBA With RF Matching And Electronic Tuning
  • Pick And Place For Chip Packages (01005 And 0201 Components) With Pitch Of 0.2mm
  • Packaging: Ball Grid Array (BGA), Ultra-Fine Ball Grid Array (uBGA), Quad Flat Pack No-Lead (QFN), Quad Flat Package (QFP), Small Outline
  • Integrated Circuit (SOIC), Plastic Leaded Chip Carrier (PLCC), And Package On Package (PoP)
  • RF Microelectronics: Agilent 8960 Series 10 And Keysight Uxm Wireless Test Set E7515a
  • High Speed, Flexible Surface Mount Assembly Lines.
  • Through-Hole Assembly Lines.
  • High Speed / High-Accuracy Pick And Place Systems.
  • Component Placement Down To 01005.
  • Fine Pitch And High Density PCBs.
  • Fine Pitch/Bga Re-Work: Wds-650
  • Functional Certification Test (FCT)
  • Hi-Pot Reliability Test
  • Firmware Programming
  • Analog, Digital, And Mixed Signal Functional Test
Thru Hole & SMT Video Tour