PCB Assembly
Our latest PCBA & SMT capabilities include support for 01005, high-count BGAs, POP, RF, press fit,
wave and selective soldering for double and single sided reflow.
wave and selective soldering for double and single sided reflow.
- (AOI) Automated Optical Inspection
- PCBA Manufacturer (Layers 1-8) Smt, Thru-Hole, With Single And Double Sided Reflow
- No-Clean And Water Soluble Flux.
- Lead-Free / Rohs Compliant Wave Soldering.
- PCBA With RF Matching And Electronic Tuning
- Pick And Place For Chip Packages (01005 And 0201 Components) With Pitch Of 0.2mm
- Packaging: Ball Grid Array (BGA), Ultra-Fine Ball Grid Array (uBGA), Quad Flat Pack No-Lead (QFN), Quad Flat Package (QFP), Small Outline
- Integrated Circuit (SOIC), Plastic Leaded Chip Carrier (PLCC), And Package On Package (PoP)
- RF Microelectronics: Agilent 8960 Series 10 And Keysight Uxm Wireless Test Set E7515a
- High Speed, Flexible Surface Mount Assembly Lines.
- Through-Hole Assembly Lines.
- High Speed / High-Accuracy Pick And Place Systems.
- Component Placement Down To 01005.
- Fine Pitch And High Density PCBs.
- Fine Pitch/Bga Re-Work: Wds-650
- Functional Certification Test (FCT)
- Hi-Pot Reliability Test
- Firmware Programming
- Analog, Digital, And Mixed Signal Functional Test
Thru Hole & SMT Video Tour